At the left – with water jet; at the right – conventional cutting technique with protective air jet.
It is developed for making holes and cutting silicon wafers and other materials. The cutting process is performed in water. Apart from the low pressure water, high pressure water microjet is supplied to the cutting point, providing effective cooling and removal of ablation products. The laser beam passes through the low pressure water cell and is focused on the workpiece in the center of high pressure water microjet (up to 200 Bar).
|Operation area||up to 400 х 400 mm|
|Cutting speed||60 mm/min|
|Laser wavelength||1.06 µm or 0.53 µm|
|Focusing wais diameter||30 µm|
|Repetition rate||30 kHz|
|Power density||4х107 W/cm2|
|Water microjet diameter||150 µm|
|Water pressure||20 – 100 Bar|
|Energy consumption||1 kW|
Photon Processes Department of the Institute of Physics (V.M. Kadan).
Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43