Laser-induced plasma complex for
micromachining of transparent materials

Laser-induced plasma complex for micromachining of transparent materials
Micromachining in silica (1) and glass (2) made using controlled LC mask.

It is designed for precise micromachining, for example microlabeling, of transparent materials. Cheap and reliable neodymium laser of wavelength 1.06 µm or 0.53 µm induces intermediate plasma phase which imparts energy into material. Laser beam propagates through a transparent sample with an opaque elastic target behind it. Plasma, which is created in a narrow space between the sample and the target, interacts with the transparent sample causing the micromachining process.

Features:

Machining area up to 2 x 2 mm
Laser wavelength 1.06 or 0.53µm
Machining time 15 s
Materials glass, silica, sapphire and others
Machining depth 5 – 200 µm
Resolution 10 µm
Energy consumption 200 W
Water microjet diameter 150 µm
Water pressure 20 – 100 Bar
Energy consumption 1 kW

Applications:

  • microelectronics and microoptics;
  • souvenir manufacturing;
  • outward advertisement.

Developer:

Photon Processes Department of the Institute of Physics (V.M. Kadan).

Contact information:

Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43
E-mail: fesenko@iop.kiev.ua