Micromachining in silica (1) and glass (2) made using controlled LC mask.
It is designed for precise micromachining, for example microlabeling, of transparent materials. Cheap and reliable neodymium laser of wavelength 1.06 µm or 0.53 µm induces intermediate plasma phase which imparts energy into material. Laser beam propagates through a transparent sample with an opaque elastic target behind it. Plasma, which is created in a narrow space between the sample and the target, interacts with the transparent sample causing the micromachining process.
|Machining area||up to 2 x 2 mm|
|Laser wavelength||1.06 or 0.53µm|
|Machining time||15 s|
|Materials||glass, silica, sapphire and others|
|Machining depth||5 – 200 µm|
|Energy consumption||200 W|
|Water microjet diameter||150 µm|
|Water pressure||20 – 100 Bar|
|Energy consumption||1 kW|
Photon Processes Department of the Institute of Physics (V.M. Kadan).
Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43