Laser complex for micromachining of opaque materials "MICROSTAMP"

Laser complex for micromachining of opaque materials MICROSTAMP
Micromachining in SiC (left) and microgear of Ni foil, thickness 50 µm (right)

It is designed for micromachining of metal, ceramics and superhard materials. The technological process includes depositing of the polymer mask on a sample. Then laser radiation evaporates the mask.

Features:

Machining area up to 2 x 2 mm
Laser wavelength 1.06 or 0.53 µm
Machining time 2 s
Materials Metals, ceramics, semiconductors
Machining depth 5 – 300 µm
Resolution 10 µm
Energy consumption 500 W

Developer:

Photon Processes Department of the Institute of Physics (V.M. Kadan).

Contact information:

Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43
E-mail: fesenko@iop.kiev.ua