Micromachining in SiC (left) and microgear of Ni foil, thickness 50 µm (right)
It is designed for micromachining of metal, ceramics and superhard materials. The technological process includes depositing of the polymer mask on a sample. Then laser radiation evaporates the mask.
Features:
Machining area | up to 2 x 2 mm |
Laser wavelength | 1.06 or 0.53 µm |
Machining time | 2 s |
Materials | Metals, ceramics, semiconductors |
Machining depth | 5 – 300 µm |
Resolution | 10 µm |
Energy consumption | 500 W |
Developer:
Photon Processes Department of the Institute of Physics (V.M. Kadan).
Contact information:
Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43
E-mail: fesenko@iop.kiev.ua