Laser etching of wood (left) and glass (center); laser cutting of plastic (right)
It used for cutting and etching of plastic, glass, and wooden plates of thickness up to 10 mm. The complex is compact and cost-efficient.
Features:
Machining area | up to 800 x 650 mm |
СО2 laser power | 40 W |
Laser wavelength | 10.6 µm |
Cutting speed | 2 cm/s |
Materials | Plastic, glass, wood |
Machining depth | 5 – 300 µm |
Resolution | 50 µm |
Energy consumption | 500 W |
Applications:
Developer:
Photon Processes Department of the Institute of Physics (V.M. Kadan).
Contact information:
Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43
E-mail: fesenko@iop.kiev.ua