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Laser etching of wood (left) and glass (center); laser cutting of plastic (right)
It used for cutting and etching of plastic, glass, and wooden plates of thickness up to 10 mm. The complex is compact and cost-efficient.
Features:
| Machining area | up to 800 x 650 mm |
| СО2 laser power | 40 W |
| Laser wavelength | 10.6 µm |
| Cutting speed | 2 cm/s |
| Materials | Plastic, glass, wood |
| Machining depth | 5 – 300 µm |
| Resolution | 50 µm |
| Energy consumption | 500 W |
Applications:
Developer:
Photon Processes Department of the Institute of Physics (V.M. Kadan).
Contact information:
Tel. +38 (044) 525 98 41
Fax: +38 (044) 525 15 43
E-mail: fesenko@iop.kiev.ua