Nanocomposites and nanomaterials

Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints 
Wodak I.1, Yakymovych A.1, Strutz P.1, Wimmer C.1, Yerbol S.1, Khatibi G.1,2
1Institute of Chemical Technologies and Analytics, TU Wien, Vienna 1060, Austria
2Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics, TU Wien, Vienna 1060, Austria

E-mail: andriy.yakymovych@tuwien.ac.at

The concept of hybrid solder joints is a promising approach to improve the mechanical reliability of lead-free solder joints. For instance, the mechanical reliability of such solder/Cu joints has been improved by minor additions of nano-sized particles, while the morphology of the solder joints has been also enhanced [1].
The present research is the follow-up of our previous study of the hybrid Sn-3.0Ag-0.5Cu (SAC305) solder joints [2]. Furthermore, we have synthesized Ni nanoparticles (NPs) by the chemical reduction method. The Sn-5.0Ag foil has been used in this study to produce the solder joints, while the Ni NPs have been mixed into the commercial flux. As an alternative, the TiO2 and ZrO2 NPs have been used to produce the hybrid Sn-0.5Ag/Cu solder joints.
According to the SEM analysis, the morphology at the interface solder/Cu has been enhanced by the addition of nano-sized inclusions. The shear strength of the hybrid solder joints has been also improved compared to the undoped joint. The experimental results have been compared with the literature.

Financial support for this study came from the Austrian Science Fund (FWF) under Project No. P 34894.
 
1.	Sujan G.K., Haseeb A.S.M.A., Nishikawa H., et al. Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux // J Alloy Compd.-2017.- 695.-P. 981-990.
2.	Aspalter A., Cerny A., Goeschl M., et al. Nanocomposite solder joints: morphology and mechanical properties of Sn-3.0Ag-0.5Cu solder joints by adding ceramic nanoparticles through flux doping // Appl Nanosci.-2020.-10.-4943-4949.